AppAsia Berhad and CMSC Inc. Sign MOU for Joint Venture in IC Design

Summary:
AppAsia Berhad has signed a Memorandum of Understanding (MOU) with Taiwan-based CMSC, Inc. to create a joint special purpose venture (SPV) focused on integrated circuit (IC) design services in Malaysia. The collaboration will cover IC front-end design, back-end design, and turnkey solutions. The partnership is part of AppAsia’s strategic expansion into the semiconductor industry, aiming to diversify its business activities and optimize shareholder value by leveraging the combined expertise and resources of both companies. AppAsia specializes in mobile applications, digital content, e-commerce, IT security, and cloud solutions, while CMSC is a listed company on the Taiwan Emerging Stock Market, known for its IC design services.